Invention Grant
- Patent Title: Holistic thermal management system for a semiconductor chip
- Patent Title (中): 半导体芯片整体热管理系统
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Application No.: US11948124Application Date: 2007-11-30
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Publication No.: US08058724B2Publication Date: 2011-11-15
- Inventor: Gamal Refai-Ahmed
- Applicant: Gamal Refai-Ahmed
- Applicant Address: CA Markham
- Assignee: ATI Technologies ULC
- Current Assignee: ATI Technologies ULC
- Current Assignee Address: CA Markham
- Agent Timothy M. Honeycutt
- Main IPC: H01L23/373
- IPC: H01L23/373
Abstract:
Various semiconductor chip thermal management systems and methods are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a substrate and coupling a diamond heat spreader that has a thermoelectric cooler to the semiconductor chip. A vapor chamber is coupled to the diamond heat spreader.
Public/Granted literature
- US20090140417A1 Holistic Thermal Management System for a Semiconductor Chip Public/Granted day:2009-06-04
Information query
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