Invention Grant
US08058772B2 Method and device for moving an element to be driven using an actuating element formed by etching in a semiconductor material
有权
使用通过在半导体材料中蚀刻形成的致动元件来移动待驱动元件的方法和装置
- Patent Title: Method and device for moving an element to be driven using an actuating element formed by etching in a semiconductor material
- Patent Title (中): 使用通过在半导体材料中蚀刻形成的致动元件来移动待驱动元件的方法和装置
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Application No.: US11886504Application Date: 2006-03-16
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Publication No.: US08058772B2Publication Date: 2011-11-15
- Inventor: Patrice Minotti , Gilles Bourbon , Patrice Le Moal , Eric Joseph
- Applicant: Patrice Minotti , Gilles Bourbon , Patrice Le Moal , Eric Joseph
- Applicant Address: FR Besancon
- Assignee: Silmach
- Current Assignee: Silmach
- Current Assignee Address: FR Besancon
- Agency: Pauley Petersen & Erickson
- Priority: FR0502700 20050318
- International Application: PCT/EP2006/060806 WO 20060316
- International Announcement: WO2006/097516 WO 20060921
- Main IPC: H02N2/12
- IPC: H02N2/12
Abstract:
The invention concerns an element to be driven, a driving element designed to be urged into engagement with the element to be driven and an actuating element adapted to move the driving element so that it drives the element to be driven in step-by-step displacement, the driving element and the actuating element being formed by etching in a semiconductor material wafer. The invention is characterized in that it comprises elastic prestressing means for maintaining the driving element in contact with the element to be driven.
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