A test apparatus for an electronic device package is provided, which includes a test socket having a first portion with a recess for receiving an electronic device package having external terminals arranged in a terminal configuration and a second portion. An interchangeable insert board is disposed between the first portion and the second portion and extended on the recess, which includes first contact pads arranged in a first pad configuration compatible with the terminal configuration and facing the recess and second contact pads arranged in a second pad configuration and disposed between the first and the second portions. Trace layers each electrically connects one of the first contact pads to one of the second contact pads. The contact pins each penetrates through the second portion and electrically connects to one of the second pads, wherein the contact pins are arranged in a pin configuration compatible with the second pad configuration.