Invention Grant
- Patent Title: Magnetic interconnection device
- Patent Title (中): 磁互连装置
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Application No.: US12489015Application Date: 2009-06-22
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Publication No.: US08058957B2Publication Date: 2011-11-15
- Inventor: James M. Irion, II , Brian W. Johansen
- Applicant: James M. Irion, II , Brian W. Johansen
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Baker Botts L.L.P.
- Main IPC: H01P1/10
- IPC: H01P1/10 ; H01H53/04

Abstract:
According to one embodiment, a first magnetic coupling element is coupled to a first conductive element of a first electrical circuit. A second magnetic coupling element is coupled to a second conductive element of a second electrical circuit. The second magnetic coupling element is operable to attract the first magnetic coupling element using a magnetic force such that electrical contact is made between the first conductive element and the second conductive element.
Public/Granted literature
- US20090317985A1 Magnetic Interconnection Device Public/Granted day:2009-12-24
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