Invention Grant
- Patent Title: Vehicular electronics assembly
- Patent Title (中): 车载电子组件
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Application No.: US12511889Application Date: 2009-07-29
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Publication No.: US08059411B2Publication Date: 2011-11-15
- Inventor: Yunqi Zheng , John E. Proulx
- Applicant: Yunqi Zheng , John E. Proulx
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations LLC
- Current Assignee: GM Global Technology Operations LLC
- Current Assignee Address: US MI Detroit
- Agency: Ingrassia Fisher & Lorenz P.C.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/28
Abstract:
An electronics assembly for use in a vehicle is provided. The assembly comprises a heat sink, a dam coupled to the heat sink, the dam and the heat sink combining to form a reservoir, an electronic component positioned within the reservoir, and a thermally conductive layer conformally molded to the electronic component and disposed between the electronic component and the heat sink.
Public/Granted literature
- US20110026226A1 VEHICULAR ELECTRONICS ASSEMBLY Public/Granted day:2011-02-03
Information query
