Invention Grant
- Patent Title: Surface mountable device
- Patent Title (中): 表面贴装装置
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Application No.: US10565334Application Date: 2004-07-16
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Publication No.: US08059420B2Publication Date: 2011-11-15
- Inventor: Yoshihiko Nishizawa
- Applicant: Yoshihiko Nishizawa
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2003-199968 20030722
- International Application: PCT/JP2004/010188 WO 20040716
- International Announcement: WO2005/008698 WO 20050127
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01R9/00

Abstract:
A surface mountable device includes a ceramic substrate including a first principal surface, a second principal surface, and a side surface connecting the first principal surface to the second principal surface, a terminal electrode disposed on the first principal surface, and a first conductor for appearance inspection extending continuously from the terminal electrode to the side surface and having a width smaller than the width of the terminal electrode.
Public/Granted literature
- US20070274055A1 Surface Mountable Device Public/Granted day:2007-11-29
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