Invention Grant
- Patent Title: Handoff of data attachment point
- Patent Title (中): 切换数据连接点
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Application No.: US12046062Application Date: 2008-03-11
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Publication No.: US08059595B2Publication Date: 2011-11-15
- Inventor: Peerapol Tinnakornsrisuphap , Fatih Ulupinar , Parag A. Agashe , Ragulan Sinnarajah , Ravindra Patwardhan , Rajat Prakash
- Applicant: Peerapol Tinnakornsrisuphap , Fatih Ulupinar , Parag A. Agashe , Ragulan Sinnarajah , Ravindra Patwardhan , Rajat Prakash
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: H04W4/00
- IPC: H04W4/00

Abstract:
In a communication system in which a gateway entity is linked to a plurality of infrastructure entities which in turn are operable to communicate with an access terminal, the access terminal needs first to establish a data attachment point (DAP) with one of the infrastructure entities. Handoff of the DAP from one infrastructure entity to another infrastructure entity is initiated by the access terminal. The access terminal weighs factors such as the link conditions with the various infrastructure entities, the time since the last DAP handoff, and time duration communicating with the current infrastructure entity before proceeding with the DAP handoff.
Public/Granted literature
- US20080247360A1 Handoff of Data Attachment Point Public/Granted day:2008-10-09
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