Invention Grant
- Patent Title: Potted insert installation and validation
- Patent Title (中): 盆栽插入安装和验证
-
Application No.: US12138971Application Date: 2008-06-13
-
Publication No.: US08060232B2Publication Date: 2011-11-15
- Inventor: Michael P. Kuntz , Mark L. Younie , Gary E. Georgeson
- Applicant: Michael P. Kuntz , Mark L. Younie , Gary E. Georgeson
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Hope Baldauff Hartman, LLC
- Main IPC: G06F19/00
- IPC: G06F19/00 ; G01B3/00 ; G01F1/00 ; G01F7/00

Abstract:
Methods and computer storage media provide for the installation of potted inserts and installation validation. According to embodiments described herein, an insert is placed within an insert aperture of a panel or other structure. Potting compound is injected into a potting cavity surrounding the insert through a fill hole in the insert until potting compound overflows from another fill hole. The installation is validated by applying a force to the installed insert at a determined frequency using a mechanical impedance instrument and measuring a response frequency. The response frequency is compared to an acceptable frequency range to determine whether the insert is properly installed.
Public/Granted literature
- US20090326702A1 Potted Insert Installation and Validation Public/Granted day:2009-12-31
Information query