Invention Grant
- Patent Title: Molecular assembly
- Patent Title (中): 分子装配
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Application No.: US12237795Application Date: 2008-09-25
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Publication No.: US08063207B2Publication Date: 2011-11-22
- Inventor: Kazuhiko Umemoto , Hisato Takeuchi , Hiroshi Nakamura , Arimitsu Usuki , Makoto Fujita
- Applicant: Kazuhiko Umemoto , Hisato Takeuchi , Hiroshi Nakamura , Arimitsu Usuki , Makoto Fujita
- Applicant Address: JP Aichi JP Tokyo
- Assignee: Kabushiki Kaisha Toyota Chuo Kenkyusho,The University of Tokyo
- Current Assignee: Kabushiki Kaisha Toyota Chuo Kenkyusho,The University of Tokyo
- Current Assignee Address: JP Aichi JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2007-249926 20070926
- Main IPC: C07F9/80
- IPC: C07F9/80 ; C07F15/00
Abstract:
A molecular assembly comprising a host metal complex with a space formed therein, and compounds having substituents enclosed in the metal complex within the space and molecular chains bonded to the substituents and extending to the exterior of the metal complex, wherein two or more substituents are enclosed in the same space of the metal complex.
Public/Granted literature
- US20090082563A1 MOLECULAR ASSEMBLY Public/Granted day:2009-03-26
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