Invention Grant
- Patent Title: Methods of forming embedded thermoelectric coolers with adjacent thermally conductive fields
- Patent Title (中): 形成具有相邻导热场的嵌入式热电冷却器的方法
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Application No.: US11563443Application Date: 2006-11-27
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Publication No.: US08063298B2Publication Date: 2011-11-22
- Inventor: David A. Koester , Randall G. Alley
- Applicant: David A. Koester , Randall G. Alley
- Applicant Address: US NC Durham
- Assignee: Nextreme Thermal Solutions, Inc.
- Current Assignee: Nextreme Thermal Solutions, Inc.
- Current Assignee Address: US NC Durham
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Main IPC: H01L35/02
- IPC: H01L35/02 ; H01L35/34
Abstract:
A method of forming a thermoelectric device may include providing a substrate having a surface, and thermally coupling a thermoelectric p-n couple to a first portion of the surface of a substrate. Moreover, the thermoelectric p-n couple may include a p-type thermoelectric element and an n-type thermoelectric element. In addition, a thermally conductive field layer may be formed on a second portion of the surface of the substrate adjacent the first portion of the surface of the substrate. Related structures are also discussed.
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