Invention Grant
- Patent Title: Wired circuit board and producing method thereof
- Patent Title (中): 有线电路板及其制造方法
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Application No.: US11898503Application Date: 2007-09-12
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Publication No.: US08063312B2Publication Date: 2011-11-22
- Inventor: Yasunari Ooyabu , Jun Ishii , Kensuke Nishi
- Applicant: Yasunari Ooyabu , Jun Ishii , Kensuke Nishi
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2006-262817 20060927
- Main IPC: H05K1/03
- IPC: H05K1/03
Abstract:
A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board, an insulating base layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the insulating base layer and a having a terminal portion. An opening is formed in the insulating base layer to expose the metal foil.
Public/Granted literature
- US20080075918A1 Wired circuit board and producing method thereof Public/Granted day:2008-03-27
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