Invention Grant
US08063316B2 Split wave compensation for open stubs 有权
开放桩的分波补偿

Split wave compensation for open stubs
Abstract:
In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a second end near said second surface; a second via having a first end near said first surface and a second end near said second surface; a first conductive element electrically coupling said first end of said first via and said first end of said second via; a second conductive element electrically coupling said second end of said first via and said second end of said second via; an input signal line coupled to said first via; and an output signal line coupled to said second via.
Public/Granted literature
Information query
Patent Agency Ranking
0/0