Invention Grant
- Patent Title: Split wave compensation for open stubs
- Patent Title (中): 开放桩的分波补偿
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Application No.: US11818508Application Date: 2007-06-14
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Publication No.: US08063316B2Publication Date: 2011-11-22
- Inventor: Dan Gorcea
- Applicant: Dan Gorcea
- Applicant Address: US CO Broomfield
- Assignee: Flextronics AP LLC
- Current Assignee: Flextronics AP LLC
- Current Assignee Address: US CO Broomfield
- Agency: Sheridan Ross PC
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a second end near said second surface; a second via having a first end near said first surface and a second end near said second surface; a first conductive element electrically coupling said first end of said first via and said first end of said second via; a second conductive element electrically coupling said second end of said first via and said second end of said second via; an input signal line coupled to said first via; and an output signal line coupled to said second via.
Public/Granted literature
- US20080308313A1 Split wave compensation for open stubs Public/Granted day:2008-12-18
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