Invention Grant
US08063318B2 Electronic component with wire bonds in low modulus fill encapsulant
有权
具有低模量填充密封剂中引线键合的电子部件
- Patent Title: Electronic component with wire bonds in low modulus fill encapsulant
- Patent Title (中): 具有低模量填充密封剂中引线键合的电子部件
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Application No.: US12364514Application Date: 2009-02-03
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Publication No.: US08063318B2Publication Date: 2011-11-22
- Inventor: Susan Williams , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
- Applicant: Susan Williams , Laval Chung-Long-Shan , Kiangkai Tankongchumruskul
- Applicant Address: AU Balmain, New South Wales
- Assignee: Silverbrook Research Pty Ltd
- Current Assignee: Silverbrook Research Pty Ltd
- Current Assignee Address: AU Balmain, New South Wales
- Main IPC: H01L23/28
- IPC: H01L23/28
Abstract:
An electronic component that has a support structure with a plurality of electrical conductors, a series of wire bonds, each of the wire bonds extending from one of the electrical conductors respectively, each of the wire bonds having an end section contacting the electrical conductor and an intermediate section contiguous with the end section, a bead of dam encapsulant encapsulating the electrical conductors and the end section of each of the wire bonds, and a bead of fill encapsulant contacting the bead of dam encapsulant and encapsulating the intermediate portion of each of the wire bonds. The dam encapsulant has a higher modulus of elasticity than the fill encapsulant.
Public/Granted literature
- US20090135569A1 ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT Public/Granted day:2009-05-28
Information query
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