Invention Grant
- Patent Title: Keypad assembly
- Patent Title (中): 键盘装配
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Application No.: US12405550Application Date: 2009-03-17
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Publication No.: US08063325B2Publication Date: 2011-11-22
- Inventor: Fu-Hsin Sung , Yi-Hua Wang
- Applicant: Fu-Hsin Sung , Yi-Hua Wang
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee: Chi Mei Communication Systems, Inc.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200810304556 20080919
- Main IPC: H01H9/00
- IPC: H01H9/00

Abstract:
An exemplary keypad assembly includes: a printed circuit board (PCB) comprising a plurality of fixed contact points formed thereon, an elastic sheet disposed on the PCB, the elastic sheet comprising a base and many switches fixed on the base above the fixed contact points correspondingly; many key buttons, each key button comprising a main portion, and a pressing portion extending downward from the main portion; a light shielding sheet defining a plurality of through holes, the light shielding sheet integrally formed with the key buttons, the key buttons respectively passing through each of the through holes of the light shield sheet. The light shielding sheet with the key buttons is disposed above the elastic sheet, each pressing portion of each key button corresponding to each switch. The keypad assembly has a thin configuration due to a combination configuration of the light shielding sheet and the key buttons.
Public/Granted literature
- US20100072047A1 KEYPAD ASSEMBLY Public/Granted day:2010-03-25
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