Invention Grant
- Patent Title: Circuit board, method for manufacturing the same, and semiconductor device
- Patent Title (中): 电路基板及其制造方法以及半导体装置
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Application No.: US11748111Application Date: 2007-05-14
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Publication No.: US08063486B2Publication Date: 2011-11-22
- Inventor: Koichi Hirano , Tsukasa Shiraishi , Seiichi Nakatani , Tatsuo Ogawa
- Applicant: Koichi Hirano , Tsukasa Shiraishi , Seiichi Nakatani , Tatsuo Ogawa
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JP2006-135576 20060515
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A circuit board 1 having a base material 10 and an electrode 11 formed on at least one main surface of the base material 10 includes an easy peeling portion 12 formed in at least one of an inner portion and a side portion of the electrode 11, with the adhesive strength between the electrode 11 and the easy peeling portion 12 being less than the adhesive strength between the electrode 11 and the base material 10. A circuit board that has high connection reliability and enables narrow pitch mounting thereby can be provided.
Public/Granted literature
- US20070262447A1 CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE Public/Granted day:2007-11-15
Information query
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