The present invention has an object to reduce a thickness of a protecting film having a small thermal conductivity. A thermal head includes: a plurality of heat generating resistors formed via an insulating layer; a driver circuit unit for driving the plurality of heat generating resistors to generate a heat; a wiring for connecting the driver circuit unit to the plurality of heat generating resistors; a protecting film formed to cover the plurality of heat generating resistors, the driver circuit unit and the wiring, wherein the plurality of heat generating resistors, the driver circuit unit, the wiring 11 and the protecting film are formed on a substrate, and wherein a thermal conductor having a thermal conductivity larger than that of the protecting film is disposed on the protecting film, in opposition to each of the plurality of heat generating resistors.