Invention Grant
- Patent Title: Positioning wafer lenses on electronic imagers
- Patent Title (中): 将晶片镜头定位在电子成像器上
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Application No.: US12260915Application Date: 2008-10-29
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Publication No.: US08063975B2Publication Date: 2011-11-22
- Inventor: Andrew Butterfield , Sebastien Fabre , Karo Kujanpaa
- Applicant: Andrew Butterfield , Sebastien Fabre , Karo Kujanpaa
- Applicant Address: US FL St. Petersburg
- Assignee: Jabil Circuit, Inc.
- Current Assignee: Jabil Circuit, Inc.
- Current Assignee Address: US FL St. Petersburg
- Main IPC: H04N5/225
- IPC: H04N5/225
Abstract:
A low cost manufacturing method (300) and assembly (100) for positioning a lens (106) relative to an electronic imager (102). A viscous adhesive (104) is applied to the lens (106) or the electronic imager (102) outside of the optical path. The lens (106) is disposed on the electronic imager (102) exclusively with the adhesive (104) disposed between them.
Public/Granted literature
- US20100103308A1 POSITIONING WAFER LENSES ON ELECTRONIC IMAGERS Public/Granted day:2010-04-29
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