Invention Grant
US08064186B2 Method of manufacturing capacitive elements for a capacitive device
有权
制造用于电容器件的电容元件的方法
- Patent Title: Method of manufacturing capacitive elements for a capacitive device
- Patent Title (中): 制造用于电容器件的电容元件的方法
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Application No.: US12129259Application Date: 2008-05-29
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Publication No.: US08064186B2Publication Date: 2011-11-22
- Inventor: Terje Skog , Svein Moller Nilsen
- Applicant: Terje Skog , Svein Moller Nilsen
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Eschweiler & Associates, LLC
- Priority: EP07109362 20070531
- Main IPC: H01G5/00
- IPC: H01G5/00

Abstract:
A method of manufacturing capacitive elements for a capacitive device which comprises one or more layers is provided. At least one layer is etched from a first surface to a second surface thereof to form two sections of the layer, such that the sections are movable relative to one another, and such that a wall extending from the first surface to the second surface is formed on each of the two sections, the walls defining a gap therebetween. An etching step forms multiple recesses in each wall such that multiple capacitive elements are defined between adjacent recesses, the capacitive elements of one wall being offset from those of the other wall when the sections are stationary with respect to one another. A corresponding capacitive device is also provided.
Public/Granted literature
- US20080297974A1 Method of Manufacturing Capacitive Elements for a Capacitive Device Public/Granted day:2008-12-04
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