Invention Grant
- Patent Title: Electronic module with ejector mechanism
- Patent Title (中): 带喷射器机构的电子模块
-
Application No.: US12287966Application Date: 2008-10-14
-
Publication No.: US08064207B2Publication Date: 2011-11-22
- Inventor: Jerry Wu
- Applicant: Jerry Wu
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agent Wei Te Chung; Andrew C. Cheng; Ming Chieh Chang
- Main IPC: G02B6/36
- IPC: G02B6/36 ; G02B6/00

Abstract:
An electronic module (10) includes a housing having a longitudinal body portion and a mounting portion extending rearward from the body portion, with a channel (1221) defined in a top or bottom section of the mounting portion; an ejector mechanism including a slider member (61) accommodated in the channel of mounting portion and an actuator member (62) pivotally engaged with the mounting portion, said actuator member further linked to the slider member for pushing the slider member forwardly moving along the channel; and a spring member (8) arranged between the slider member and the mounting portion and capable of pushing the slider member rearward moving along the channel.
Public/Granted literature
- US20100091466A1 Electronic module with ejector mechanism Public/Granted day:2010-04-15
Information query