Invention Grant
- Patent Title: Edge connector
- Patent Title (中): 边缘连接器
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Application No.: US12465675Application Date: 2009-05-14
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Publication No.: US08064216B2Publication Date: 2011-11-22
- Inventor: Shinji Shibao
- Applicant: Shinji Shibao
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: JP2008-318501 20081215
- Main IPC: H05K3/00
- IPC: H05K3/00

Abstract:
An edge connector includes, a multilayer printed board having an inner layer and a connector edge, an electronic circuit disposed on the multilayer printed board, an electrical terminal on the multilayer printed board and spaced by a predetermined clearance from the connector edge, an electrical conductor on the multilayer printed board and connected between the electronic circuit and the electrical terminal, a via connected to the electrical terminal and extending to the inner layer of the multilayer printed board, and a lead conductor on the inner layer of the multilayer printed board and connected at one end to the via, another end of the lead conductor being exposed at the connector edge. The electrical terminal is plated. The sum of the length of the via and the length of the lead conductor is less than one-sixth of the wavelength of an electrical signal transmitted.
Public/Granted literature
- US20100151703A1 EDGE CONNECTOR AND MANUFACTURING METHOD THEREFOR Public/Granted day:2010-06-17
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