Invention Grant
- Patent Title: Electronic submission preparation
- Patent Title (中): 电子提交准备
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Application No.: US11824303Application Date: 2007-06-29
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Publication No.: US08065599B1Publication Date: 2011-11-22
- Inventor: Zeke M. Lui
- Applicant: Zeke M. Lui
- Applicant Address: US MA Hopkinton
- Assignee: EMC Corporation
- Current Assignee: EMC Corporation
- Current Assignee Address: US MA Hopkinton
- Agency: Van Pelt, Yi & James LLP
- Main IPC: G06F17/00
- IPC: G06F17/00
Abstract:
Preparing an electronic submission is disclosed. A document is received. Submission preparation information to be used by a submission kernel for processing is identified based at least in part on information from the document. The document is processed based at least in part on the submission preparation information to produce one or more derived document outputs.
Information query
