Invention Grant
- Patent Title: Frit sealing of large device
- Patent Title (中): 大型装置的玻璃料密封
-
Application No.: US12074156Application Date: 2008-02-29
-
Publication No.: US08067883B2Publication Date: 2011-11-29
- Inventor: Wenchao Wang
- Applicant: Wenchao Wang
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Siwen Chen
- Main IPC: H01J1/88
- IPC: H01J1/88 ; H01J19/42 ; H01K1/18

Abstract:
A hermetically sealed device comprising a spacing unit and a resistive heating element desirably having a closed-loop structure and process for hermetically sealing a device by using such heating element and spacing unit. The frit can form multiple closed-loops to prevent crack propagation. The heating element can be advantageously made of a metal such as Invar® and/or Kovar®. The invention enables hermetic frit sealing with low residual stress in the seal for large-area displays. The invention is particularly advantageous for hermetic sealing of OLED display devices having a large area, such as those above 10 inches (25 cm).
Public/Granted literature
- US20090218932A1 Frit sealing of large device Public/Granted day:2009-09-03
Information query