Invention Grant
- Patent Title: Photomask, method of lithography, and method for manufacturing the photomask
- Patent Title (中): 光掩模,光刻方法和制造光掩模的方法
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Application No.: US12314404Application Date: 2008-12-10
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Publication No.: US08068213B2Publication Date: 2011-11-29
- Inventor: Takashi Sato , Takashi Sakamoto
- Applicant: Takashi Sato , Takashi Sakamoto
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JPP2003-303479 20030827
- Main IPC: G03B27/32
- IPC: G03B27/32 ; G03C5/00

Abstract:
A photomask has a monitoring pattern configured to obtain information required for adjusting optical system of a projection lithography tool. The monitoring pattern encompasses a mask substrate and an asymmetrical diffraction grating delineated on the mask substrate, configured to generate a positive first order diffracted light and a negative first order diffracted light in different diffraction efficiencies. The asymmetrical diffraction grating includes a plurality of probing-phase shifters, disposed periodically on the mask substrate in parallel, and a plurality of opaque strips disposed on light-shielding faces of the probing-phase shifters. An asymmetrically recessed ridge implements each of the probing-phase shifters.
Public/Granted literature
- US20090098473A1 Photomask, method of lithography, and method for manufacturing the photomask Public/Granted day:2009-04-16
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