Invention Grant
- Patent Title: Circuit board with identifiable information and method for fabricating the same
- Patent Title (中): 具有可识别信息的电路板及其制造方法
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Application No.: US12076425Application Date: 2008-03-18
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Publication No.: US08070932B2Publication Date: 2011-12-06
- Inventor: Shih-Ping Hsu , Shang-Wei Chen , Suo-Hsia Tang , Chao-Wen Shih
- Applicant: Shih-Ping Hsu , Shang-Wei Chen , Suo-Hsia Tang , Chao-Wen Shih
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Taoyuan
- Agency: Clark & Brody
- Priority: TW93111196A 20040422
- Main IPC: C25D5/02
- IPC: C25D5/02
Abstract:
A circuit board with identifiable information and a method for fabricating the same are proposed. At least one insulating layer within the circuit board has a non-circuit area free of a circuit layout. A plurality of openings are formed in the non-circuit area of the insulating layer. A patterned circuit layer is formed on the insulating layer. Metal identifiable information is disposed in the openings of the non-circuit area. By this arrangement, a product status of the circuit board can be traced and identified via the metal patterned information.
Public/Granted literature
- US20080166497A1 Circuit board with identifiable information and method for fabricating the same Public/Granted day:2008-07-10
Information query
