Invention Grant
US08076951B2 Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis 失效
喷雾冷却热管理系统和半导体探测,诊断和故障分析方法

Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis
Abstract:
A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The spray heads and probe head are disposed in a sealed manner inside a spray chamber that, during operation, is urged in a sealing manner onto a sealing plate holding the integrated circuit under test. The atomized mist cools the integrated circuit and then condenses on the spray chamber wall. The condensed fluid is pumped out of the chamber and is circulated in a chiller, so as to be re-circulated and injected again into the micro-spray heads. The pressure inside the spray chamber may be controlled to provide a desired boiling point.
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