Invention Grant
- Patent Title: Method for thickness calibration and measuring thickness of material
- Patent Title (中): 厚度校准和测量材料厚度的方法
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Application No.: US12711230Application Date: 2010-02-23
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Publication No.: US08077827B2Publication Date: 2011-12-13
- Inventor: Ming-Hwei Perng
- Applicant: Ming-Hwei Perng
- Applicant Address: TW Taipei
- Assignee: Test Research, Inc.
- Current Assignee: Test Research, Inc.
- Current Assignee Address: TW Taipei
- Agency: CKC & Partners Co., Ltd.
- Main IPC: G01N23/06
- IPC: G01N23/06

Abstract:
A method for measuring the thickness of a first absorbing material in the presence of a second absorbing material is provided. The method comprises the steps as follow. The thickness (tS) of the first absorbing material is fixed and the thickness of the second absorbing material is varied to obtain a calibration standard. The intensity of the transmissive energy passing through the calibration standard is detected by acquiring multiple pairs of image data comprising a foreground value (logn(Ic+s)) and a background value (logn(Ic)). The thickness (tSi) of the first absorbing material is changed and the above steps are repeated to obtain sets of image data. A fitting constant Id is determined to describe each set of the intensity data as μ s α t S = log n ( I c + I d ) - log n ( I c + s + I d ) . A best fit of the proportional constant μ s α is determined to further calculate an unknown thickness of the first absorbing material (ts′) through the equation t s ′ = α μ s [ ln ( I c ′ + I d ) - ln ( I c + s ′ + I d ) ] .
Public/Granted literature
- US20110206182A1 METHOD FOR THICKNESS CALIBRATION AND MEASURING THICKNESS OF MATERIAL Public/Granted day:2011-08-25
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