Invention Grant
- Patent Title: Wiring information generating apparatus, method and program
- Patent Title (中): 接线信息生成装置,方法和程序
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Application No.: US12559837Application Date: 2009-09-15
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Publication No.: US08079010B2Publication Date: 2011-12-13
- Inventor: Tomoyuki Isomura
- Applicant: Tomoyuki Isomura
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2008-244438 20080924
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A wiring information generating apparatus includes an input unit that inputs a wiring layer number indicating a wiring layer, a via layer number indicating a next via layer to connect the wiring layer, and spacing information based on wiring rules. A storage unit stores a terminal figure table providing terminal figures, a logic element device wire protected area table, and a wire protected area table. A wire protected area creation unit adds an area of a terminal figure and a logic element device wire protected area obtained by searching the terminal figure table and the logic element device wire protected area table based on the input wiring layer number and/or via layer number and acquires wire layer-via layer spacing information. A wiring information generating unit generates wiring information in the wiring layer based on connection information and arrangement information of the semiconductor logic circuit, and wire protected area information.
Public/Granted literature
- US20100077373A1 WIRING INFORMATION GENERATING APPARATUS, METHOD AND PROGRAM Public/Granted day:2010-03-25
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