Invention Grant
- Patent Title: Intervertebral implant with fixation mechanism
- Patent Title (中): 椎间植入物与固定机制
-
Application No.: US12326682Application Date: 2008-12-02
-
Publication No.: US08080062B2Publication Date: 2011-12-20
- Inventor: William D Armstrong , Gary S. Lindemann
- Applicant: William D Armstrong , Gary S. Lindemann
- Applicant Address: US IN Warsaw
- Assignee: Warsaw Orthopedic, Inc.
- Current Assignee: Warsaw Orthopedic, Inc.
- Current Assignee Address: US IN Warsaw
- Main IPC: A61F2/44
- IPC: A61F2/44

Abstract:
The present application is directed to implants for positioned between vertebral members. The implant may include a superior surface to contact against a first vertebral member, and an inferior surface to contact against a second vertebral member. The implant includes a fixation mechanism that is operable to extend a portion of the fixation mechanism into the vertebral members immediately above and below the implanted implant to affix the implant within the vertebral space between such vertebral members. The implant is substantially open in the superior and inferior directions to allow for the introduction of bone growth material within the interior of the implant to help promote fusion between the vertebral members.
Public/Granted literature
- US20100137989A1 INTERVERTEBRAL IMPLANT WITH FIXATION MECHANISM Public/Granted day:2010-06-03
Information query
IPC分类: