Disclosed is related to a thermosetting resin composition which comprises a polyimide resin (A) having a phenolic hydroxyl group, preferably a polyimide resin (A) produced from an aminophenol (a), a diamino compound (b) and a tetrabasic acid dianhydride (c), and an epoxy resin (B); and a cured product thereof. The resin composition is excellent in storage stability, and gives a cured product excellent in flame retardancy and heat resistance. Furthermore, when the cured product is in a film form, the product has sufficient flexibility and excellent folding endurance.