Invention Grant
- Patent Title: Integrated circuit packaging system with interposer interconnections and method of manufacture thereof
- Patent Title (中): 具有插入器互连的集成电路封装系统及其制造方法
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Application No.: US12473253Application Date: 2009-05-27
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Publication No.: US08080446B2Publication Date: 2011-12-20
- Inventor: A Leam Choi , Kenny Lee , In Sang Yoon , HanGil Shin
- Applicant: A Leam Choi , Kenny Lee , In Sang Yoon , HanGil Shin
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/31
- IPC: H01L23/31
Abstract:
A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit; mounting a routing structure having a functional side above the integrated circuit; mounting a vertical interconnect to the functional side of the routing structure and the vertical interconnect extending vertically away from the routing structure; and forming an encapsulation that encapsulates the integrated circuit, the routing structure.
Public/Granted literature
- US20100301469A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER INTERCONNECTIONS AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2010-12-02
Information query
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