Invention Grant
- Patent Title: Reactive purge compound for polymer purging
- Patent Title (中): 用于聚合物清洗的反应性清洗化合物
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Application No.: US12502556Application Date: 2009-07-14
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Publication No.: US08080506B2Publication Date: 2011-12-20
- Inventor: Mitsuzo Shida , Wen-Li Adam Chen
- Applicant: Mitsuzo Shida , Wen-Li Adam Chen
- Applicant Address: US IL Arlington Heights
- Assignee: MSI Technology LLC.
- Current Assignee: MSI Technology LLC.
- Current Assignee Address: US IL Arlington Heights
- Agency: Dobrusin & Thennisch PC
- Main IPC: C11D13/18
- IPC: C11D13/18

Abstract:
The present invention relates to reactive purge compound for cleaning polymer processing equipment wherein the reactive purge compound that includes i) at least about 50 wt.% of a polymeric carrier component based on the total weight of the reactive purge compound; and ii) a chain scission catalyst component dispersed in the polymeric carrier component; wherein a) the chain scission catalyst component includes a chain scission catalyst selected from the group consisting of at least one alkali metal hydroxide, at least one alkaline earth metal hydroxide, and any combination thereof; b) the reactive purge compound further comprises a water generating component; or c) both (a) and (b); wherein the reactive purge compound is a feedstock material in the form of a plurality of pellets, granules, rods, powder or other particles.
Public/Granted literature
- US20110012275A1 REACTIVE PURGE COMPOUND FOR POLYMER PURGING Public/Granted day:2011-01-20
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