Invention Grant
- Patent Title: Curable organopolysiloxane composition and semiconductor device
- Patent Title (中): 可固化有机聚硅氧烷组合物和半导体器件
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Application No.: US12306049Application Date: 2007-06-18
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Publication No.: US08080614B2Publication Date: 2011-12-20
- Inventor: Yoshitsugu Morita , Masayoshi Terada , Hiroji Enami , Makoto Yoshitake
- Applicant: Yoshitsugu Morita , Masayoshi Terada , Hiroji Enami , Makoto Yoshitake
- Applicant Address: JP Chiyoda-ku, Tokyo
- Assignee: Dow Corning Toray Company, Ltd.
- Current Assignee: Dow Corning Toray Company, Ltd.
- Current Assignee Address: JP Chiyoda-ku, Tokyo
- Agency: Howard & Howard Attorneys PLLC
- Priority: JP2006-173777 20060623
- International Application: PCT/JP2007/062649 WO 20070618
- International Announcement: WO2007/148812 WO 20071227
- Main IPC: C08L83/04
- IPC: C08L83/04

Abstract:
A curable organopolysiloxane composition comprises at least the following components: an organopolysiloxane (A) represented by the following general formula: R13SiO(R12SiO)mSiR13 (where R1 is a monovalent hydrocarbon group, and “m” is an integer from 0 to 100); an organopolysiloxane (B) represented by the following average unit formula: (R2SiO3/2)a(R22SiO2/2)b(R23SiO1/2)c (where R2 is a monovalent hydrocarbon group, and “a”, “b”, and “c” are specific numbers); an organopolysiloxane (C) having in one molecule on average at least two silicon-bonded aryl groups and on average at least two silicon-bonded hydrogen atoms; and a hydrosilylation-reaction catalyst (D); is characterized by good fillability and curability and that, when cured, forms a cured body that possesses a high refractive index, high light transmissivity, and strong adhesion to various substrates.
Public/Granted literature
- US20090179180A1 Curable Organopolysiloxane Composition and Semiconductor Device Public/Granted day:2009-07-16
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