Invention Grant
- Patent Title: Polymerizable composition, crosslinkable resin, and manufacture methods and applications thereof
- Patent Title (中): 可聚合组合物,可交联树脂及其制备方法和应用
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Application No.: US12446126Application Date: 2007-10-19
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Publication No.: US08080623B2Publication Date: 2011-12-20
- Inventor: Kiyoshige Kojima , Junji Kodemura
- Applicant: Kiyoshige Kojima , Junji Kodemura
- Applicant Address: JP Tokyo
- Assignee: Zeon Corporation
- Current Assignee: Zeon Corporation
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2006-285811 20061020; JP2006-293847 20061030
- International Application: PCT/JP2007/070409 WO 20071019
- International Announcement: WO2008/047895 WO 20080424
- Main IPC: C08G61/08
- IPC: C08G61/08 ; C08F2/02 ; B32B15/08 ; C08F4/70

Abstract:
A polymerizable composition suitable as an electric material and the like used in an electric circuit board, which comprises a norbornene monomer, a metathesis polymerization catalyst, and a chain transfer agent composed of a compound represented by formula (A): CH2═CH—Y—OCO—CR1═CH2 wherein Y represents a divalent hydrocarbon group having 3 to 20 carbon atoms, and R1 represents a hydrogen atom or a methyl group. By further comprising a crosslinking agent in the polymerizable composition, obtaining a crosslinkable resin by carrying out bulk polymerization, and crosslinking the crosslinkable resin to obtain a molded article and a crosslinked resin composite having excellent characteristics such as electric insulation, adhesion, mechanical strength, heat resistance, dielectric properties and the like.
Public/Granted literature
- US20110144292A1 POLYMERIZABLE COMPOSITION, CROSSLINKABLE RESIN, AND MANUFACTURE METHODS AND APPLICATIONS THEREOF Public/Granted day:2011-06-16
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