Invention Grant
US08080735B2 Styrenic polymers as blend components to control adhesion between olefinic substrates
有权
苯乙烯聚合物作为共混组分以控制烯烃底物之间的粘附
- Patent Title: Styrenic polymers as blend components to control adhesion between olefinic substrates
- Patent Title (中): 苯乙烯聚合物作为共混组分以控制烯烃底物之间的粘附
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Application No.: US12679423Application Date: 2008-09-04
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Publication No.: US08080735B2Publication Date: 2011-12-20
- Inventor: Bharat I. Chaudhary , Kawai P. Pang , Michael B. Biscoglio
- Applicant: Bharat I. Chaudhary , Kawai P. Pang , Michael B. Biscoglio
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- Agency: Whyte Hirschboeck Dudek SC
- International Application: PCT/US2008/075245 WO 20080904
- International Announcement: WO2009/042364 WO 20090402
- Main IPC: H01B7/00
- IPC: H01B7/00
Abstract:
The insulation shield layer of a power cable having a blend of ethylene copolymer, e.g., vinyl acetate, and a Styrenic polymer, e.g., polystyrene. The insulation shield layer is adjacent to a polyolefin insulation layer of the power cable.
Public/Granted literature
- US20100209056A1 Styrenic Polymers as Blend Components to Control Adhesion Between Olefinic Substrates Public/Granted day:2010-08-19
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