Invention Grant
- Patent Title: Top contact LED thermal management
- Patent Title (中): 热门联系LED热管理
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Application No.: US12183772Application Date: 2008-07-31
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Publication No.: US08080827B2Publication Date: 2011-12-20
- Inventor: Wei Shi
- Applicant: Wei Shi
- Applicant Address: US CA Livermore
- Assignee: Bridgelux, Inc.
- Current Assignee: Bridgelux, Inc.
- Current Assignee Address: US CA Livermore
- Agency: Haynes and Boone, LLP
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L31/12 ; H01L27/15
Abstract:
An LED having enhanced heat dissipation is disclosed. For example, an LED die can have extended bond pads that are configured to enhance heat flow from an active region of the LED to a lead frame. A heat transmissive substrate can further enhance heat flow away from the LED die. By enhancing heat dissipation, more current can be used to drive the LED. The use of more current facilitates the production of brighter LEDs.
Public/Granted literature
- US20100025718A1 Top contact LED thermal management Public/Granted day:2010-02-04
Information query
IPC分类:
