A mounting structure includes a first substrate that has a first surface and a second surface, a plurality of first connection terminals that are disposed on the first surface in a first direction, a plurality of second connection terminals that are disposed on the first surface in a second direction perpendicular to the first direction and that are disposed at predetermined gaps from the first connection terminals, a plurality of connection wiring lines that are disposed on the second surface, each having first portions that overlap the first and second connection terminals in plan view and a second portion that is formed to have a width narrower than those of the first and second connection terminals in the first direction, a plurality of through holes that pass through the first substrate so as to correspondingly connect the second connection terminals to the connection wiring lines, and a second substrate that has a plurality of third connection terminals correspondingly connected to the first and second connection terminals and correspondingly overlap the first and second connection terminals in plan view.