Invention Grant
- Patent Title: Adhesive air guiding device and motherboard having the same
- Patent Title (中): 粘合剂引导装置和主板具有相同的性能
-
Application No.: US12558578Application Date: 2009-09-14
-
Publication No.: US08081453B2Publication Date: 2011-12-20
- Inventor: Zheng-Heng Sun
- Applicant: Zheng-Heng Sun
- Applicant Address: TW Tu-Cheng, New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200910301880 20090427
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A motherboard including an electronic component is provided. Airflow flows through the motherboard along a direction. An adhesive air guiding device including at least one air guiding surface facing the direction of the airflow is stuck to the electronic component, for guiding the airflow to flow over the electronic component.
Public/Granted literature
- US20100271778A1 ADHESIVE AIR GUIDING DEVICE AND MOTHERBOARD HAVING THE SAME Public/Granted day:2010-10-28
Information query
