Invention Grant
- Patent Title: Circuitized substrate with continuous thermoplastic support film dielectric layers
- Patent Title (中): 具有连续热塑性支撑膜电介质层的电路基板
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Application No.: US12081051Application Date: 2008-04-10
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Publication No.: US08084863B2Publication Date: 2011-12-27
- Inventor: Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
- Applicant: Robert M. Japp , Voya R. Markovich , Kostas I. Papathomas , Mark D. Poliks
- Applicant Address: US NY Endicott
- Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee: Endicott Interconnect Technologies, Inc.
- Current Assignee Address: US NY Endicott
- Agency: Hinman, Howard & Kattell
- Agent Mark Levy; Lawrence R. Fraley
- Main IPC: H01L23/50
- IPC: H01L23/50
Abstract:
A circuitized substrate including a dielectric layer having a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin and not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on the dielectric layer. A method of making this substrate is also provided.
Public/Granted literature
- US20080191354A1 Circuitized substrate with p-aramid dielectric layers and method of making same Public/Granted day:2008-08-14
Information query
IPC分类:
