Invention Grant
- Patent Title: RF chip test method
- Patent Title (中): RF芯片测试方法
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Application No.: US12356481Application Date: 2009-01-20
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Publication No.: US08085059B2Publication Date: 2011-12-27
- Inventor: Hsuan-Chung Ko , Hsiu-Ju Chen
- Applicant: Hsuan-Chung Ko , Hsiu-Ju Chen
- Applicant Address: TW Hsin-Chu
- Assignee: King Yuan Electronics Co., Ltd.
- Current Assignee: King Yuan Electronics Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Stout, Uxa, Buyan & Mullins, LLP
- Priority: TW97144743A 20081119
- Main IPC: G01R31/00
- IPC: G01R31/00

Abstract:
An RF chip test method is disclosed. The RF chip test method includes disposing an RF chip within a chip socket, with the RF chip having at least one RF pin and at least one non-RF pin, the chip socket having conductive elements, and the conductive elements contacting the RF pin and the non-RF pin; connecting the non-RF pin to a ground end and connecting the RF pin to an RF measuring instrument; measuring a S11 parameter of the RF pin using the RF measuring instrument; and comparing the S11 parameter with an allowable range so as to judge the contact condition between the RF pin and the conductive element.
Public/Granted literature
- US20100123475A1 RF CHIP TEST METHOD Public/Granted day:2010-05-20
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