Invention Grant
US08085535B2 Fan casing integrated heat spreader for active cooling of computing system skins
有权
风扇套管集成散热器，用于计算系统外观的主动冷却
- Patent Title: Fan casing integrated heat spreader for active cooling of computing system skins
- Patent Title (中): 风扇套管集成散热器，用于计算系统外观的主动冷却
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Application No.: US12641813Application Date: 2009-12-18
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Publication No.: US08085535B2Publication Date: 2011-12-27
- Inventor: Jered H. Wikander , Mark MacDonald
- Applicant: Jered H. Wikander , Mark MacDonald
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Jordan IP Law, PC
- Agent B. Delano Jordan
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
In one embodiment, a fan casing may have a direct thermal connection with a heat spreader. The fan casing might be used in an active cooling system of a mobile computing device such as a notebook computer to reduce and/or eliminate the occurrence of thermal hot spots on the skin of the device. In one example, the heat spreader extends from the enclosure and is disposed between a heat source and the skin of the device.
Public/Granted literature
- US20110149504A1 FAN CASING INTEGRATED HEAT SPREADER FOR ACTIVE COOLING OF COMPUTING SYSTEM SKINS Public/Granted day:2011-06-23
Information query
