Invention Grant
- Patent Title: Fluid-cooled electronic housing assembly and system
- Patent Title (中): 流体冷却电子外壳组件和系统
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Application No.: US12605307Application Date: 2009-10-23
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Publication No.: US08085538B2Publication Date: 2011-12-27
- Inventor: Valod Noshadi , Juri Woinkoff
- Applicant: Valod Noshadi , Juri Woinkoff
- Applicant Address: DE Karlsbad
- Assignee: Haman Becker Automotive Systems GmbH
- Current Assignee: Haman Becker Automotive Systems GmbH
- Current Assignee Address: DE Karlsbad
- Agency: The Eclipse Group LLP
- Priority: EP08018684 20081024
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A fluid-cooled electronic housing assembly (“FCEHA”) configured for mounting within a vehicle is described. The FCEHA may be part of a fluid-cooled electronic system (“FCES”) that includes the FCEHA and a plurality of electronic components. The FCEHA is capable of providing effective cooling for the FCES while maintaining a small space requirement by utilizing a fluid cooling system that cools the housing of FCEHA. In general, the FCEHA includes a cooling-fluid channel through a heat sink that, in operation, allows a cooling fluid/liquid to flow throw the cooling-fluid channel and cool off the FCEHA more efficiently that air convection because the cooling fluid is more efficient in heat transport.
Public/Granted literature
- US20100195285A1 Fluid-Cooled Electronic Housing Assembly and System Public/Granted day:2010-08-05
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