Invention Grant
- Patent Title: Heat dissipation device and electronic system incorporating the same
- Patent Title (中): 散热装置及其组合的电子系统
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Application No.: US12770749Application Date: 2010-04-30
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Publication No.: US08085542B2Publication Date: 2011-12-27
- Inventor: Jian Yang
- Applicant: Jian Yang
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.,Foxconn Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200910312081 20091223
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A heat dissipation device for a first electronic component and a second electronic component mounted on a circuit board includes a first base mounted on the first electronic component and a second base mounted on the second electronic component. The second base is movably connected with the first base. An electronic system incorporating the heat dissipation device is also provided.
Public/Granted literature
- US20110149515A1 HEAT DISSIPATION DEVICE AND ELECTRONIC SYSTEM INCORPORATING THE SAME Public/Granted day:2011-06-23
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