Invention Grant
US08085545B2 Structure for blocking an electromagnetic interference, wafer level package and printed circuit board having the same
有权
用于阻挡电磁干扰的结构，晶片级封装和具有该干扰的印刷电路板
- Patent Title: Structure for blocking an electromagnetic interference, wafer level package and printed circuit board having the same
- Patent Title (中): 用于阻挡电磁干扰的结构，晶片级封装和具有该干扰的印刷电路板
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Application No.: US12453720Application Date: 2009-05-20
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Publication No.: US08085545B2Publication Date: 2011-12-27
- Inventor: Eun-Seok Song
- Applicant: Eun-Seok Song
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2008-0047165 20080521
- Main IPC: H05K7/00
- IPC: H05K7/00
Abstract:
A structure for blocking electromagnetic interference (EMI) may include at least one electromagnetic wave inducing member and an electromagnetic wave filtering member. The at least one electromagnetic wave inducing member may be provided to an electronic device to induce an electromagnetic wave applied to the electronic device. The electromagnetic wave filtering member may be provided to the electronic device to filter the electromagnetic wave induced by the at least one electromagnetic wave inducing member. Thus, the electromagnetic wave filtering member may remove the electromagnetic wave concentrated on the at least one electromagnetic wave inducing member, so that the electromagnetic wave applied to the electronic device may be effectively removed. As a result, circuits in the electronic device may be protected from the EMI.
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