Invention Grant
- Patent Title: Vacuum packaging system
- Patent Title (中): 真空包装系统
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Application No.: US12469829Application Date: 2009-05-21
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Publication No.: US08087219B2Publication Date: 2012-01-03
- Inventor: Peng Liu , Pi-Jin Chen , Bing-Chu Du , Cai-Lin Guo , Liang Liu , Shou-Shan Fan
- Applicant: Peng Liu , Pi-Jin Chen , Bing-Chu Du , Cai-Lin Guo , Liang Liu , Shou-Shan Fan
- Applicant Address: CN Beijing TW Tu-Cheng, New Taipei
- Assignee: Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Beijing TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200810067428 20080523
- Main IPC: B65B31/00
- IPC: B65B31/00

Abstract:
A vacuum packaging system for packaging a vacuum apparatus includes a first accommodating room, a second container, a vacuum room, a first hatch, a second hatch, a delivery apparatus, a discharge device, and a heating apparatus. The delivery apparatus transports the vacuum apparatus from the first accommodating room to the vacuum room to the second accommodating room. The discharge device discharges a sealing element to seal an exhaust through hole of the vacuum apparatus. The heating apparatus is mounted on the inner wall of the vacuum room between the second hatch and the transport pipeline to heat and soften the sealing element.
Public/Granted literature
- US20090288363A1 VACUUM PACKAGING SYSTEM Public/Granted day:2009-11-26
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