Invention Grant
- Patent Title: Edible wafer products produced by extrusion
- Patent Title (中): 通过挤出生产的食用晶圆产品
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Application No.: US12440157Application Date: 2007-09-10
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Publication No.: US08087300B2Publication Date: 2012-01-03
- Inventor: Christophe Dautremont , Rodolfo De Acutis , Hugo Piguet
- Applicant: Christophe Dautremont , Rodolfo De Acutis , Hugo Piguet
- Applicant Address: CH Vevey
- Assignee: Nestec S.A.
- Current Assignee: Nestec S.A.
- Current Assignee Address: CH Vevey
- Agency: K&L Gates LLP
- Priority: EP06018975 20060911
- International Application: PCT/EP2007/059472 WO 20070910
- International Announcement: WO2008/031798 WO 20080320
- Main IPC: G01N3/00
- IPC: G01N3/00
Abstract:
The present invention relates to edible wafers, in particular to extruded wafers and to the use of these wafers in confectionery.
Public/Granted literature
- US20100037699A1 EDIBLE WAFER PRODUCTS PRODUCED BY EXTRUSION Public/Granted day:2010-02-18
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