Invention Grant
- Patent Title: Sectioning instrument
- Patent Title (中): 切片仪
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Application No.: US11643922Application Date: 2006-12-20
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Publication No.: US08087334B2Publication Date: 2012-01-03
- Inventor: Tatsuya Miyatani , Tetsumasa Ito , Hirohito Fujiwara , Koji Fujimoto
- Applicant: Tatsuya Miyatani , Tetsumasa Ito , Hirohito Fujiwara , Koji Fujimoto
- Applicant Address: JP Chiba
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP Chiba
- Agency: Brinks Hofer Gilson & Lione
- Priority: JP2005-377722 20051228
- Main IPC: G01N1/06
- IPC: G01N1/06

Abstract:
A sectioning instrument fabricates a section having an accurate and uniform thickness to be carried to a next step automatically without deforming a surface of an embedded block and while observing the surface of the embedded block. The sectioning instrument includes a sample base for fixing an embedded block, a cutter for fabricating a section by sectioning the embedded block, a carrier for carrying the section, and a feed mechanism for moving the sample base in a predetermined feed direction. The carrier includes a belt, a direction switching portion provided on an upper side of the cutter, and a rear roller. The belt is inserted to between the cutter and the direction switching portion from a rear side of the cutter, folded back to an upper side by the direction switching portion and is reeled back to the rear side of the cutter by the rear roller substantially in parallel with the feed direction of the feed mechanism in a plane view.
Public/Granted literature
- US20070157786A1 Sectioning instrument Public/Granted day:2007-07-12
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