Invention Grant
- Patent Title: Substrate holding rotating mechanism, and substrate processing apparatus
- Patent Title (中): 基板保持旋转机构，以及基板处理装置
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Application No.: US13073340Application Date: 2011-03-28
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Publication No.: US08087419B2Publication Date: 2012-01-03
- Inventor: Hiroyuki Kaneko , Takahiro Ogawa , Kenichi Sugita
- Applicant: Hiroyuki Kaneko , Takahiro Ogawa , Kenichi Sugita
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2006-100178 20060331
- Main IPC: B08B3/02
- IPC: B08B3/02 ; H01L21/68
Abstract:
A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holding a periphery of a substrate, a rotating device for rotating at least one of the clamp rollers, at least one base member on which at least one of the spindles is installed, and a rotational mechanism adapted to allow the base member to be rotatable.
Public/Granted literature
- US20110168214A1 SUBSTRATE HOLDING ROTATING MECHANISM, AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2011-07-14
Information query
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