Invention Grant
- Patent Title: Material placement method and apparatus
- Patent Title (中): 材料放置方法和装置
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Application No.: US12570250Application Date: 2009-09-30
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Publication No.: US08087441B2Publication Date: 2012-01-03
- Inventor: Robert Ray Wampler , Muhammad Zia Ullah
- Applicant: Robert Ray Wampler , Muhammad Zia Ullah
- Applicant Address: US KS Wichita
- Assignee: Spirit AeroSy$tems, Inc.
- Current Assignee: Spirit AeroSy$tems, Inc.
- Current Assignee Address: US KS Wichita
- Agency: Hovey Williams LLP
- Main IPC: B32B37/00
- IPC: B32B37/00 ; B44C7/00

Abstract:
A material placement head for dispensing and compacting a plurality of strips of a material onto a surface with a plurality of independently movable roller assemblies. Each roller assembly of the placement head comprises a compacting roller and may be rotatably and linearly moved in six-degrees of freedom independent of the other roller assemblies of the placement head. The roller assemblies may be arranged in a staggered configuration and substantially simultaneously apply the plurality of strips of the material to the surface, such that the strips of the material are applied to adjacent paths on the surface. Each compacting roller may be malleable and substantially crowned around its outer circumferential surface to provide even compaction to the strips of the material.
Public/Granted literature
- US20100024952A1 MATERIAL PLACEMENT METHOD AND APPARATUS Public/Granted day:2010-02-04
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