Invention Grant
US08087442B2 Adhesive sheet bonding device 有权
粘合片粘合装置

  • Patent Title: Adhesive sheet bonding device
  • Patent Title (中): 粘合片粘合装置
  • Application No.: US12441065
    Application Date: 2007-08-27
  • Publication No.: US08087442B2
    Publication Date: 2012-01-03
  • Inventor: Atsumi Ihara
  • Applicant: Atsumi Ihara
  • Applicant Address: JP Osaka
  • Assignee: AI & DI Co., Ltd.
  • Current Assignee: AI & DI Co., Ltd.
  • Current Assignee Address: JP Osaka
  • Agency: Young & Thompson
  • Priority: JP2006-249349 20060914
  • International Application: PCT/JP2007/066520 WO 20070827
  • International Announcement: WO2008/032550 WO 20080320
  • Main IPC: B65H37/04
  • IPC: B65H37/04
Adhesive sheet bonding device
Abstract:
A sheet attaching apparatus includes a non-adhesive guide sheet for leading the peeled sheet to the attaching position while keeping away from the substrate; a stopper to which forward edges of the substrate and the sheet contact, movable between a position across the feed path and a position off the feed path; a movable press roller for pressing the forward portion of the sheet onto the forward portion of the substrate to attach the sheet onto the substrate at the attaching position; and a feed roller arranged facing the press roller and for discharging the adhered sheet and substrate from the attaching position. The guide sheet has slits extending in the feed direction at the forward portion. The press roller presses the forward portion of the sheet to the forward portion of the substrate through the slits so as to attach the sheet S onto the substrate.
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