Invention Grant
- Patent Title: Roll polishing apparatus
- Patent Title (中): 辊抛光装置
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Application No.: US12867848Application Date: 2008-03-21
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Publication No.: US08087448B2Publication Date: 2012-01-03
- Inventor: Katsumi Nakayama , Hiroyuki Otsuka , Shiro Osada , Hisahiko Fukase
- Applicant: Katsumi Nakayama , Hiroyuki Otsuka , Shiro Osada , Hisahiko Fukase
- Applicant Address: JP Tokyo
- Assignee: IHI Corporation
- Current Assignee: IHI Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- International Application: PCT/JP2008/000664 WO 20080321
- International Announcement: WO2009/116119 WO 20090924
- Main IPC: B22D11/06
- IPC: B22D11/06

Abstract:
A roll polishing apparatus that can suppress cracks on a strip. The roll polishing apparatus includes brush rolls which face outer periphery of chilled rolls over an axial length of the chilled rolls, respectively, cylinders which urge the brush rolls wholly to the chilled rolls, respectively, and cylinders which deform the brush rolls in conformity to crowns of the chilled rolls, respectively. By these elements, wires of the brush rolls are uniformly contacted on outer peripheries of the chilled rolls to wipe off oxides adhering to the outer peripheries of the chilled rolls.
Public/Granted literature
- US20110119858A1 ROLL POLISHING APPARATUS Public/Granted day:2011-05-26
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